发明名称 |
3DIC Packages with Heat Dissipation Structures |
摘要 |
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM. |
申请公布号 |
US2016284670(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
US201615172330 |
申请日期 |
2016.06.03 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hung Wensen;Huang Szu-Po;Chen Kim Hong;Jeng Shin-Puu |
分类号 |
H01L25/065;H01L23/367;H01L25/00 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
bonding a device die onto a package substrate; bonding a die stack onto the device die, wherein the die stack comprises a plurality of dies, and the device die comprises:
a first portion overlapped by the die stack; anda second portion extending laterally beyond an edge of the die stack; dispensing a first Thermal Interface Material (TIM) onto a top surface of the die stack; dispensing a second TIM onto the second portion of the device die; adhering a heat dissipating lid to the first TIM; and adhering a heat dissipating ring to the second TIM. |
地址 |
Hsin-Chu TW |