| 发明名称 |
COIL-EMBEDDED INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed herein, a coil disposed in the at least partially machined space, a filling material filling air gaps in a space around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate. |
| 申请公布号 |
US2016284462(A1) |
申请公布日期 |
2016.09.29 |
| 申请号 |
US201514946611 |
申请日期 |
2015.11.19 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
AHN Jin Mo |
| 分类号 |
H01F27/28;H01F41/04 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A coil-embedded integrated circuit substrate comprising:
a core substrate having an at least partially machined space formed therein; a coil disposed in the at least partially machined space; a filling material filling air gaps in a space around the coil in the at least partially machined space; and insulating layers formed on upper and lower surfaces of the core substrate. |
| 地址 |
Suwon-Si KR |
