| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board excellent in adhesion between an insulating film and a copper foil after a gold plating process.SOLUTION: In the flexible printed wiring board, an insulating film obtained from a photosensitive resin composition containing at least (A) a binder polymer, (B) a radically polymerizable compound, (C) a photopolymerization initiator, (D) a thermosetting resin, and (E) a filler is laminated on a copper foil. The roughness (Rz) of the copper foil and the average particle diameter (r) of the filler (E) in the photosensitive resin composition satisfy a relationship of Rz<r<4Rz. The average particle diameter (r) of the filler (E) is 0.5 μm≤r≤10 μm. |
