| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-sealing lid material for PTP packaging having heat resistance to endure heating in thermally sealing a PTP package even without using a curing agent which may emit formaldehyde as a resin component.SOLUTION: There is provided a lid for PTP packaging which is obtained by providing a printing layer on one surface or both surfaces of an aluminum foil and further providing a heat-resistant coating layer on one side of it and a heat-sealing adhesive layer on the another side of it, wherein at least one layer of the heat-resistant coating layer and the printing layer is formed by using a coating material or ink obtained by blending a resin component obtained by preliminarily subjecting a part of a resin component of the coating material or the ink for forming a heat-resistant coating layer or a printing layer to thermal condensation, with the remaining resin component. |
