| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a resin composition for optical semiconductor element components which, when used as an optical semiconductor element sealing material or an enclosure package component material, has a high light transmittance, can retain its high light transmittance even on long-term exposure to light and is excellent also in heat resistance. <P>SOLUTION: This resin composition for the optical semiconductor element components is a resin composition containing a (meth)acrylic polymer and a resin comprising a polymerizable monomer, wherein the (meth)acrylic polymer has at least one polymerizable double bond in the molecule. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
