发明名称 Package for micromirror device
摘要 The present invention discloses a mirror device that includes a mirror element which further comprising an elastic hinge and a mirror and which modulates incident light emitted from a light source, a device substrate on which a drive circuit for driving the mirror element is placed, a package substrate which is made of transparent glass or a silicon material and on which the device substrate is placed, a metallic thermal transfer path connected to the device substrate, and a cover glass connected to the package substrate so that the device substrate is covered.
申请公布号 US2009008669(A1) 申请公布日期 2009.01.08
申请号 US20080231922 申请日期 2008.09.05
申请人 MAEDA YOSHIHIRO;NISHINO HIROKAZU;SHIRAI AKIRA;ICHIKAWA HIROTOSHI;ISHII FUSAO 发明人 MAEDA YOSHIHIRO;NISHINO HIROKAZU;SHIRAI AKIRA;ICHIKAWA HIROTOSHI;ISHII FUSAO
分类号 H01L33/00 主分类号 H01L33/00
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