| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry cleaning method for processor by which an accurate end point can be detected. SOLUTION: A sensor for measuring and monitoring a chamber pressure, a material density, or thickness of a deposited film during cleaning is provided in a processor 11, and the end point is detected on the basis of data from the sensor. Or plasma is partially generated in the chamber 11, and the emission intensity of the plasma is monitored to detect the end point. Or light is radiated into the chamber, and light having passed through the chamber is measured and monitored to detect the end point. COPYRIGHT: (C)2009,JPO&INPIT
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