| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board in which a reflow solder and a flow solder are mixed, and an identifying mark for visually determining an unleaded and leaded state of each solder is formed immediately before a solder process. SOLUTION: A surface packaging component 12 is reflow-soldered on a first face 10a of the electronic circuit board 10 by melting and cooling of a solder paste, and a lead component 11 is inserted into a board through hole, and is flow-soldered from the side of a second face 10b by coming into contact with a melted solder and cooling. In a first identifying mark 20c provided on the first face 10a, if the reflow solder is unleaded, a metal mask of a circular core 25 is opened, and the solder paste is coated thereon, and if leaded, the metal mask is closed and the solder paste is not coated. In a second identifying mark 30c provided on the first face 10a, if the flow solder of the second face 10b is unleaded, the metal mask of a rectangular core 35 is opened, and the solder paste is coated thereon, and if leaded, the metal mask is closed and the solder paste is not coated. COPYRIGHT: (C)2009,JPO&INPIT
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