发明名称 CONNECTION STRUCTURE FOR LASER AND LASER ASSEMBLY
摘要 A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.
申请公布号 US2016294156(A1) 申请公布日期 2016.10.06
申请号 US201514944379 申请日期 2015.11.18
申请人 Hisense Broadband MultiMedia Technologies Co., Ltd. ;Hisense USA Corp. ;Hisense International Co., Ltd. 发明人 WANG Hao;MU Hongwei;HUANG YungLiang;ZHANG Shun
分类号 H01S5/022;H01S5/024 主分类号 H01S5/022
代理机构 代理人
主权项 1. A connection structure for a laser, comprising: a first insulation substrate, wherein the first insulation substrate comprises an upper surface and a lower surface, the upper surface comprising an upper conductive path and the lower surface comprising a lower conductive path; a second insulation substrate disposed on the upper surface of the first insulation substrate; an upper surface of the second insulation substrate comprises a conductive path; and the conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole.
地址 Qingdao CN