PACKAGING METHOD AND STRUCTURE OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To improve the packaging method of a semiconductor chip.

SOLUTION: The packaging method comprises the steps of preparing the semiconductor chip 5 equipped with a diaphragm region 55, forming a cap 10 above the diaphragm region 55 so as to expose the diaphragm region 55, setting the semiconductor chip 5 to a support frame 1, and mounting a mould case 20 at the periphery of the semiconductor chip 5 and at least the subregion of the support frame 1 so as to package the semiconductor chip 5.

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