| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To control generation of a defect such as crack resulting from interference of the corner portions and circuit board of ceramic laminated substrate by improving close contact strength between the terminal electrode formed on the front surface of the ceramic multilayer substrate and the ceramic laminated substrate, in the ceramic laminates substrate and the high frequency electronic component using the same ceramic laminated substrate. <P>SOLUTION: In the ceramic laminated substrate provided with a plurality of ceramics layers 70 and electrode pattern, the external surface of the ceramic laminated substrate is provided with a terminal electrode and an insulating film 15. The terminal electrode includes a underlayer 60a and an upper layer 60b formed in the electrode patterns. At least a part of the external edge of the underlayer and the ceramic layer are covered with the insulating film 15. Moreover, at least a part of the insulating film is covered with the upper layer 60b and the insulating film of the ceramic laminated substrate is held with the upper layer and the underlayer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
