| 摘要 |
PROBLEM TO BE SOLVED: To form an etching sacrificial layer and wiring by the same process by making the etching sacrificial layer to be a two-layer constitution consisting of a thin heater layer and a wiring layer, to achieve remarkably simplification of the process, to shorten the process of CRBTJ manufacturing method, and to improve reliability. SOLUTION: The sacrificial layer is made to be a three-layer constitution of wiring/heater/wiring, to be able to form an ink feeding hole prepared by vertically etching a Si(110) substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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