Solder on trace technology for interconnect attachment

摘要

A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes a pre-solder material on the sidewall and the bonding surface of the conductive trace.

主权项

1. A device, comprising:
a conductive trace on a package substrate surface, the conductive trace comprising a bonding surface and a sidewall; a passivation layer on at least one end of the conductive trace; a pre-solder material for forming a wetting surface on the sidewall and the bonding surface of the conductive trace; and a solder material coupled to the pre-solder material, wherein the solder material is distinct from the pre-solder material, and wherein a combination of the pre-solder material and the solder material forms a non-uniform solder material.