| 发明名称 | Heat dissipating circuit board and electronic device | ||
| 摘要 | A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material. | ||
| 申请公布号 | US9460984(B2) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201615041167 | 申请日期 | 2016.02.11 |
| 申请人 | NGK Insulators, Ltd. | 发明人 | Tani Makoto;Tanaka Yoshihiro;Ebigase Takashi |
| 分类号 | H01L23/10;H01L23/34;H01L23/373;H01L23/00;H01L23/498;H01L23/367 | 主分类号 | H01L23/10 |
| 代理机构 | Burr & Brown, PLLC | 代理人 | Burr & Brown, PLLC |
| 主权项 | 1. A heat dissipating circuit board for a power semiconductor, comprising: an electrode material on which the power semiconductor is mounted on a front surface thereof; and a member bonded to a front surface side of the electrode material, wherein the member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material. | ||
| 地址 | Nagoya JP | ||