Multilayer ceramic electronic component with interposer substrate having double-layered resin/plating terminals

摘要

A multilayer ceramic electronic component includes a multilayer ceramic capacitor and an interposer substrate. The multilayer ceramic capacitor includes first and second external electrodes formed of a conductive paste on both ends of a ceramic body. The interposer substrate is attached to a mounting surface of the multilayer ceramic capacitor and includes first and second connection terminals connected to the first and second external electrodes at both ends of an insulation substrate, respectively. The first and second connection terminals have a double-layer structure including first and second conductive resin layers and first and second plating layers formed on the first and second conductive resin layers.

主权项

1. A multilayer ceramic electronic component, comprising:
a multilayer ceramic capacitor including first and second external electrodes formed of a conductive paste on both ends of a ceramic body; and an interposer substrate attached to a mounting surface of the multilayer ceramic capacitor and including first and second connection terminals connected to the first and second external electrodes at both ends of an insulation substrate, respectively, the first and second connection terminals having a double-layer structure including first and second conductive resin layers and first and second plating layers disposed on the first and second conductive resin layers, wherein the first and second connection terminals are spaced apart from each other and surround both end portions of the insulation substrate.