| 摘要 |
<p>A thermosetting resin composition is provided to ensure excellent planarizability, mechanical property, UV resistance and heat resistance and to prevent yellowing and to prepare a protective film with acid resistance and alkali resistance. A thermosetting resin composition comprises a copolymer[A] of unsaturated carboxylic acids or their anhydrides(a1), an epoxy-group containing unsaturated compound(a2) and an olefinically unsaturated compound(a3); and a bismaleimide compound as a curable compound[B]. The curable compound[B] is included in the amount of 0.1~10 parts by weight based on the copolymer[A] 100.0 parts by weight. The curable compound[B] is selected from N,N'-(4,4'-diphenylmethane)bismaleimide, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane, bis(3-ethyl-4-maleimidephenyl)methane and (5-methyl-4-maleimidephenyl)methane.</p> |
