发明名称 METHOD OF FORMING A HERMETICALLY SEALED FIBER TO CHIP CONNECTIONS
摘要 Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.
申请公布号 US2016216465(A1) 申请公布日期 2016.07.28
申请号 US201615091439 申请日期 2016.04.05
申请人 Micron Technology, Inc. 发明人 Meade Roy;Sandhu Gurtej
分类号 G02B6/42;G02B6/26;G02B6/30 主分类号 G02B6/42
代理机构 代理人
主权项 1. An optical device, comprising: a photonic-integrated chip on which an optical waveguide is formed; and an optical fiber assembly comprising an optical fiber having an end surface that is pre-activated in a plasma to create dangling bonds which facilitate coupling with the optical waveguide, the end surface of the optical fiber providing a hermetically sealed optical connection to the optical waveguide formed in the photonic-integrated chip.
地址 Boise ID US