发明名称 |
PACKAGED OPTO-ELECTRONIC MODULE |
摘要 |
A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector. |
申请公布号 |
US2016216445(A1) |
申请公布日期 |
2016.07.28 |
申请号 |
US201514605650 |
申请日期 |
2015.01.26 |
申请人 |
Oracle International Corporation |
发明人 |
Thacker Hiren D.;Krishnamoorthy Ashok V.;Zheng Xuezhe;Cunningham John E. |
分类号 |
G02B6/12;H01L23/498;H04B10/80;G02B6/32;G02B6/42;H01L25/16;G02B6/30 |
主分类号 |
G02B6/12 |
代理机构 |
|
代理人 |
|
主权项 |
1. A chip package, comprising:
an integrated circuit having a front surface with first integrated-circuit connector pads and second integrated-circuit connector pads, wherein the integrated circuit is configured to: modulate data, communicate data, and serialize/deserialize data; first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads; an interposer having a bottom surface and a top surface, facing the front surface of the integrated circuit, with first interposer connector pads electrically coupled to the first integrated-circuit electrical connectors; second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads; an optical integrated circuit having a bottom surface, facing the top surface of the interposer, and a top surface, facing the front surface of the integrated circuit, with first optical-integrated-circuit connector pads electrically coupled to the second integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals; an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle. |
地址 |
Redwood City CA US |