COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide component mounting method and apparatus that can secure mounting precision without any recognition from the lower surface side of a target light emission component even when the target light emission component is positionally dispersed.SOLUTION: When a light emission component is picked up by a component mount head from a packet of a carrier tape supplied by a tape feeder and mounted on a substrate, the light emission component which is set to be sucked and held form the lower side in the packet by holding means is imaged from the upper side to recognize a light emission part of the light emission component. The light emission component is likewise set to be sucked and held by the holding means is picked up by the component mount head, and the pickup light emission component is mounted on the substrate based on a recognition result of a reference part of the substrate and a recognition result of the light emission part.SELECTED DRAWING: Figure 9