COPPER ALLOY SHEET FOR HEAT DISSIPATION COMPONENT, AND HEAT DISSIPATION COMPONENT

摘要

A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650°C or greater, makes it possible to maintain sufficient strength and heat dissipation performance in the heat dissipation member after manufacture. This copper alloy sheet for a heat dissipation component contains 1.0-4.0 mass% of Ni and/or Co and 0.2-1.2 mass% of Si, has a 3.5-5 ratio [Ni+Co]/[Si] of the total content of Ni and Co [Ni+Co] and the content of Si [Si], the remainder being Cu and unavoidable impurities, has a 300MPa or greater 0.2% proof stress after heating for 30 minutes at 850°C followed by water-cooling and subsequent aging treatment, and has a conductivity of 25% IACS or greater. This copper alloy can further contain one or more of Sn: 0.005-1.0 mass%, Mg: 0.005-0.2 mass%, and Zn: 2.0 mass% or less (not including 0 mass%).