| 发明名称 |
PACKAGE MODULE, STACK STRUCTURE OF PACKAGE MODULE, AND FABRICATING METHODS THEREOF |
| 摘要 |
A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic. |
| 申请公布号 |
US2016358837(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615071215 |
申请日期 |
2016.03.16 |
| 申请人 |
DELTA ELECTRONICS, INC. |
发明人 |
LIANG Le;HONG Shou-Yu;ZHAO Zhen-Qing |
| 分类号 |
H01L23/367;H01L23/31;H01L25/065;H01L21/48;H01L23/498;H01L23/29;H01L21/56 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package module, comprising:
a power module, comprising:
a substrate; andat least one power semiconductor component disposed on the substrate; a first thermal dissipating component disposed over the power module; and a packaging plastic covering the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component exposed from the packaging plastic. |
| 地址 |
Taoyuan City TW |
