发明名称 |
Method and apparatus for damage-free, single wafer, sonic boundary layer, megasonic cleaning |
摘要 |
A method and apparatus for megasonic cleaning of semiconductor wafers. The wafer is positioned so that the surface to be cleansed is parallel to and faces the radiating surface of a quartz or similar resonator which receives sonic waves through a liquid medium from a transducer. The sonic waves striking the wafer are preferably at about a 5° to 30° offset angle from a normally directed wave to the plane of the wafer. The layered medium is gasified and serves to couple the transducer to the resonator. A layer of degasified cleaning fluid is positioned between the resonator and the wafer.
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申请公布号 |
US2008029125(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20070888598 |
申请日期 |
2007.07.31 |
申请人 |
IMTEC ACCULINE, INC. |
发明人 |
OLESEN MICHAEL B.;STRUVEN KENNETH C.;MENDES PAUL |
分类号 |
B08B3/12 |
主分类号 |
B08B3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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