| 摘要 |
PROBLEM TO BE SOLVED: To provide a tin-silver-copper-nickel-containing plating solution which precipitates little solid substance, has adequate preservation stability for a long period of time, hardly causes a crack and a whisker in a product, and is superior in bonding strength, and to provide a tin-silver-copper-nickel-containing plated film formed by using the same. SOLUTION: The tin-silver-copper-nickel-containing plating solution includes: a medium which contains mainly water and has sulfonic acids dissolved therein; tin ions as a main component, silver ions and copper ions; and further a very small amount of nickel ions. The concentration of the tin ion is 0.15 to 1.5 mol/L; the concentration of the silver ion is 0.001 to 0.05 mol/L; the concentration of the copper ion is 0.001 to 0.01 mol/L; and the concentration of the nickel ion is 0.0000001 to 0.000004 mol/L. COPYRIGHT: (C)2009,JPO&INPIT
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