发明名称 APPLICATION DEVICE, SUBSTRATE DELIVERY METHOD AND APPLICATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an application device, a substrate delivery method and an application method for reducing cost during use. SOLUTION: In this substrate delivery method, a substrate can be easily delivered when storing a part of an external conveyance mechanism in a storage part because the storage parts for storing a part of the external conveyance mechanism when delivering the substrate between the external conveyance mechanism and the storage part are provided on a carrying-in side stage and a carrying-out side stage in a substrate conveying part, respectively. Consequently, since the substrate can be delivered even without providing an elevating pin, the total cost can be reduced by just that much, and the processing tact can be shortened. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009018917(A) 申请公布日期 2009.01.29
申请号 JP20070183388 申请日期 2007.07.12
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHO YOSHIAKI;SHIMIZU AKIHIRO;SAKAMAKI TAKUJI
分类号 B65G49/06;B05C13/00;B05D3/00;B65G51/03;H01L21/677 主分类号 B65G49/06
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