发明名称 回路基板
摘要 PROBLEM TO BE SOLVED: To provide a circuit board which balances downsizing and inhibition of malfunction caused by element mutual interference, noise and the like.SOLUTION: A circuit board of an embodiment is a circuit board in which a plurality of electronic components are mounted on a printed circuit board and which comprises: a semiconductor device mounted on the printed circuit board; and a first EBG structure provided on the printed circuit board on the side opposite to the semiconductor device, in which an operation frequency of the semiconductor device is outside a cut-off band of the first EBG structure. The first EBG structure has a mushroom structure which includes: an electrode part formed by a first conductor; a batch part which is provided almost parallel with the electrode part and formed by a second conductor and equal to or less than 10 mm square; an insulation layer provided between the electrode part and the batch part; and a via which is provided in the insulation layer between the batch part and the electrode part and connected to the batch part and the electrode part.
申请公布号 JP5937190(B2) 申请公布日期 2016.06.22
申请号 JP20140252363 申请日期 2014.12.12
申请人 株式会社東芝 发明人 佐々木 忠寛;板谷 和彦;山田 浩
分类号 H01L23/12;H01L23/00;H05K3/46 主分类号 H01L23/12
代理机构 代理人
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