发明名称 |
LIGHT-EMITTING ELEMENT PACKAGE, LIGHT-EMITTING ELEMENT PACKAGE MANUFACTURING METHOD, AND LIGHT SOURCE UNIT |
摘要 |
An embodiment relates to a light-emitting element package and a light-emitting element package manufacturing method. The light-emitting element package according to an embodiment comprises: a body having a cavity, which has an upward opening; a light-emitting element mounted on the bottom surface of the interior of the cavity; and a molding portion contained in the cavity to protect the light-emitting element, wherein the molding portion includes CYTOP, thereby not only improving optical efficiency, but also improving reliability of the product by means of excellent durability. |
申请公布号 |
WO2016133337(A1) |
申请公布日期 |
2016.08.25 |
申请号 |
WO2016KR01553 |
申请日期 |
2016.02.16 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM, Myung Hee;HONG, Jung Yeop |
分类号 |
H01L33/52 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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