发明名称 |
LAMINATE AND CIRCUIT BOARD |
摘要 |
Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion. |
申请公布号 |
US2016286653(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
US201414778162 |
申请日期 |
2014.03.27 |
申请人 |
TOPPAN FORMS CO., LTD. |
发明人 |
MORI Akihito |
分类号 |
H05K1/18;C09J169/00;C09D11/52;H05K3/32;H05K1/09 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
|
主权项 |
1. A laminate, comprising:
a silver layer on a substrate, wherein the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Conditions (i) and (ii) described below, (i) a change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed, and (ii) a change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed. |
地址 |
Tokyo JP |