发明名称 LAMINATE AND CIRCUIT BOARD
摘要 Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.
申请公布号 US2016286653(A1) 申请公布日期 2016.09.29
申请号 US201414778162 申请日期 2014.03.27
申请人 TOPPAN FORMS CO., LTD. 发明人 MORI Akihito
分类号 H05K1/18;C09J169/00;C09D11/52;H05K3/32;H05K1/09 主分类号 H05K1/18
代理机构 代理人
主权项 1. A laminate, comprising: a silver layer on a substrate, wherein the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Conditions (i) and (ii) described below, (i) a change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed, and (ii) a change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed.
地址 Tokyo JP