| 发明名称 |
Semiconductor module and power conversion device |
| 摘要 |
<p>One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13. <IMAGE></p> |
| 申请公布号 |
EP1378938(B1) |
申请公布日期 |
2006.06.14 |
| 申请号 |
EP20030014502 |
申请日期 |
2003.07.03 |
| 申请人 |
HITACHI, LTD.;HITACHI CAR ENGINEERING CO., LTD. |
发明人 |
YOSHIZAKI, ATSUHIRO;MASHINO, KEIICHI;ANAN, HIROMICHI;OCHIAI, YOSHITAKA |
| 分类号 |
H01L23/051;H01L23/367;H01L23/373;H01L25/07;H01L25/11;H02M7/48 |
主分类号 |
H01L23/051 |
| 代理机构 |
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| 地址 |
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