发明名称 ELECTROFORMING MOLD, METHOD OF MANUFACTURING ELECTROFORMING MOLD AND METHOD OF MANUFACTURING ELECTROFORMED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electroforming mold by which a plurality of electroformed components different in thickness are manufactured without dividing the electroforming mold and each of components has an electrode on the bottom surface, and to provide a method of manufacturing the electroforming mold. SOLUTION: The electroforming mold 101 includes a conductive layer 2, many resin layers which is formed on the conductive layer, an intermediate conductive film 5a interposed among the many resin layers, and a plurality of cavities having side walls each surrounded by the resin, wherein the plurality of the cavities comprises a first cavity C1 having a depth penetrating through the whole many resin layers, a second cavity C2 having a depth penetrating through a partial layers in the many resin layers and a switching cavity S having a stepwise structure in every many resin layers, the conductive layer 2 is exposed on the bottom surface of the first cavity C1, the intermediate conductive film 5a is exposed on the bottom surface of the second cavity C2, the conductive layer 2 is exposed on the bottom surface of the switching cavity S, and the intermediate conductive film 5a is exposed on each resin layer having the stepwise structure. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008208431(A) 申请公布日期 2008.09.11
申请号 JP20070047137 申请日期 2007.02.27
申请人 SEIKO INSTRUMENTS INC 发明人 NIWA TAKASHI;KISHI MATSUO
分类号 C25D1/10;C25D1/00 主分类号 C25D1/10
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