| 摘要 |
An inspection device is provided to improve reliability of inspection by detecting a contact load due to a lifting driving unit regardless of change of a needle end position of a probe on a real time. A mounting table(11) has a temperature control unit which controls temperature of a semiconductor wafer(W). An XY stage horizontally moves the mounting table. A lifting driving unit(12) lifts the mounting table top and bottom. A probe card(13) is arranged in a top side of the mounting table. An alignment unit aligns a probe(13A) of the probe card and an electrode pad of the semiconductor wafer on the mounting table. The semiconductor wafer is controlled into a fixed temperature according to a control of a control device(14). A high temperature inspection of the semiconductor wafer is performed by contacting the probe with the electrode pads.
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