发明名称 MULTI-PIECE WIRING BOARD MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which enables highly efficient and secure manufacturing of wiring boards in a multi-piece fashion, each of which has a small-sized substrate part and a projection projecting from at least one surface of he substrate part in a state of being surrounded by the surface.SOLUTION: A manufacturing method of a multi-piece wiring board 14 comprises: a lamination process of laminating on one surface of a base layer-side green sheet having a pair of surfaces, a surface layer-side green sheet 2 having a pair of surfaces to form a green sheet laminate GS1; and a formation process of recesses 10 of applying laser beams L on the surface layer-side green sheet 2 of the laminate GS1 along a longer direction of boundary faces 5 which partition a plurality of wiring boards Ha or a substrate region Pa and a crust part Ma, and which present a lattice shape in plan view, and irradiating around each boundary face 5, with laser beams L1-Ln in a width direction of the boundary faces 5 by shifting the laser beams little by little to form recesses 10 in a lattice shape in plan view with bottom faces 11 located near a surface of the base layer-side green sheet 1 in side view.SELECTED DRAWING: Figure 2
申请公布号 JP2016149419(A) 申请公布日期 2016.08.18
申请号 JP20150024822 申请日期 2015.02.11
申请人 NGK SPARK PLUG CO LTD 发明人 HIRAYAMA SATOSHI
分类号 H05K3/00;H01L23/12;H05K1/02;H05K3/46 主分类号 H05K3/00
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