| 摘要 |
The present invention solves (1) the problem of bubble voids being produced in an OCA during a baking step following adhesion of an OCA to a light-transmissive, electrically-conductive film, and (2) the problem of localized peeling of an OCA film during roll transport following adhesion of an OCA to a light-transmissive, electrically-conductive film, giving rise to deviation at the surface thereof bonded to the light-transmissive, electrically-conductive film, thereby causing the OCA film to protrude out from the edge of the light-transmissive, electrically-conductive film. This light-transmissive, electrically-conductive film contains (A) a light-transmissive support layer, and (B) a light-transmissive electrically-conductive layer, the light-transmissive, electrically-conductive film characterized in that the light-transmissive electrically-conductive layer (B) is arranged, either directly or with one or more other intervening layers, on one surface of the light-transmissive support layer (A), and the wetting tension of the surface on the opposite side from the light-transmissive electrically-conductive layer (B) is 34 dyn/cm or greater. |
