| 摘要 |
The present invention is equipped with a wiring board 30 that is provided with: an insulating board 31 that is provided with an element mounting surface 30A, i.e., a first main surface, and a rear surface 30B, i.e., a second main surface on the reverse side of the element mounting surface 30A; and a wiring layer 35, which is formed on the rear surface 30B, and which includes a wiring section 35C and a heat dissipation section 35H. The present invention is also equipped with: a power element 10, which is mounted on the element mounting surface 30A of the wiring board 30, and is connected to the wiring section 35C; a spacer 40, which is disposed between the power element 10 and the element mounting surface 30A of the wiring board 30, and is connected to a rear surface-side heat dissipation section 35H; and a heat sink 20, which sandwiches the power element 10 between the spacer 40 and the heat sink, and which is fixed to the spacer 40. |
