发明名称 |
SOLDERING PASTE AND FLUX |
摘要 |
The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at -40°C to 150°C as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn-Ag-Bi-In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at - 40°C to 150°C is obtained. |
申请公布号 |
EP2623253(A4) |
申请公布日期 |
2016.11.23 |
申请号 |
EP20110828490 |
申请日期 |
2011.03.09 |
申请人 |
KOKI COMPANY LIMITED;PANASONIC CORPORATION |
发明人 |
IRISAWA ATSUSHI;KASHIWABARA MASASHI;KONDO KENJI;HIDAKA MASAHITO |
分类号 |
B23K35/363;B23K35/02;B23K35/26;B23K35/36;B23K35/362;C22C1/04;C22C13/00;C22C13/02;H05K3/12;H05K3/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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