| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing resin material for compression molding capable of stabilizing a warpage behavior after molding or after heat treatment, greatly reducing generation of fine powder, and suppressing a defect such as a void or a chip crack at compression molding and a damage to a mold die, and also to provide a semiconductor device formed using the same.SOLUTION: A semiconductor-sealing resin material for compression molding includes (A) an epoxy resin, (B) a curative and (C) a filler. The content of (C) the filler is 85 mass% or more. The semiconductor-sealing resin material for compression molding is in a pellet-like or sheet-like molding of 3-10 mm thick.SELECTED DRAWING: Figure 1 |
