Method of cutting and machining a silicon wafer

摘要

The present invention discloses a method of cutting and machining a silicon wafer. It comprises to provide a CO₂ laser apparatus, a glass or a metal-coated substrate to be put on a supporter and a silicon wafer to be fixed on the glass or the metal-coated substrate. The CO₂ laser source is to be focused on the silicon wafer for cutting and profile machining. The invention can provide a low cost, high yield, high throughput, and high precision for cutting and machining a silicon wafer.