发明名称 |
Mechanical Structure with Integrated Electronic Components |
摘要 |
An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device. |
申请公布号 |
US2016277054(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201315032041 |
申请日期 |
2013.10.31 |
申请人 |
APPLE INC. |
发明人 |
Teil Romain A.;Wittenberg Michael B.;Martisauskas Steven J.;Sung Kuo-Hua |
分类号 |
H04B1/3888;G06F1/16;H05K3/10;H05K3/32;H05K1/09;H05K1/18 |
主分类号 |
H04B1/3888 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic device, the method comprising:
a mechanical structure that mechanically supports the electronic device and is formed of an electrically conductive material; and at least one trace formed on at least one surface of the mechanical structure that is electrically connected to the mechanical structure. |
地址 |
Cupertino CA US |