发明名称 |
CURRENT COLLECTOR, ELECTRODE STRUCTURE, NONAQUEOUS ELECTROLYTE BATTERY, AND ELECTRICITY STORAGE COMPONENT |
摘要 |
A manufacturing method for a current collector includes dispersing and agitating a fluorine-based resin and conductive particles for 5 to 60 minutes at 1000 to 5000 rpm, dispersing and agitating the fluorine-based resin and conductive particles for 10 to 120 minutes at 2000 to 7000 rpm. The resin layer includes a fluorine-based resin and conductive particles, has a thickness of 0.3 to 20 μm. The current collector has one or more of: (1) average diameter of the particles is 0.5 to 25 μm, and a surface occupying ratio of the particles at a surface is 10 to 50%; (2) surface resistance of the resin layer at 20° C. is 1.0 to 10Ω, resistance after heating at 220° C. is 200 to 600Ω, and (3) surface resistance of the resin layer at 20° C. is 1.8 to 9.7Ω, resistance after heating at 180° C. is 209 to 532Ω. |
申请公布号 |
US2016276673(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201615170469 |
申请日期 |
2016.06.01 |
申请人 |
UACJ Corporation ;UACJ Foil Corporation |
发明人 |
Kato Osamu;Saito Sohei;Honkawa Yukiou;Wasamoto Mitsuyuki;Kataoka Tsugio;Yamabe Satoshi |
分类号 |
H01M4/66;H01M4/131;H01M4/133;H01M4/1391;H01M4/1393;H01M4/505;H01M4/587;H01M4/62;H01M10/0525;H01M10/0568;H01M10/0569;H01M2/16;H01M10/0587;H01M2/02;H01M4/04 |
主分类号 |
H01M4/66 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method for a current collector having a resin layer on at least one side of a conductive substrate, comprising:
a first dispersing step of agitating a fluorine-based resin and conductive particles for 5 to 60 minutes at the rotation number of 1000 to 5000 rpm; and a second dispersing step of agitating the fluorine-based resin and conductive particles for 10 to 120 minutes at the rotation number of 2000 to 7000 rpm, wherein: the resin layer comprises the fluorine-based resin and conductive particles; the resin layer has a thickness of 0.3 to 20 μm; the current collector satisfies at least one of the following characteristics of the items (1) to (3): (1) average particle diameter of the conductive particles is 0.5 to 25 μm, and a surface occupying ratio of the conductive particles at a surface of the resin layer is 10 to 50%, (2) resistance of the surface of the resin layer at 20° C. is 1.0 to 10Ω, and resistance after heating at 220° C. is 200 to 600Ω, and (3) resistance of the surface of the resin layer at 20° C. is 1.8 to 9.7Ω, and resistance after heating at 180° C. is 209 to 532Ω. |
地址 |
Tokyo JP |