发明名称 |
MICROWAVE CIRCUIT PACKAGES HAVING A REDUCED NUMBER OF VIAS IN THE SUBSTRATE |
摘要 |
A circuit package for a microwave signal comprises a substrate (56) defining a MMIC surface (62) of the substrate (56) and an opposing non-MMIC surface (64) of the substrate (56). The substrate (56) is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface (62). A MMIC (60) is disposed on the MMIC surface (62), and the MMIC (60) is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board (52). The MMIC surface (62) faces the PC board (52) when the I/O port is electrically connected to the PC board (52). |
申请公布号 |
WO0101451(A3) |
申请公布日期 |
2008.02.28 |
申请号 |
WO2000US16102 |
申请日期 |
2000.06.13 |
申请人 |
MICROSUBSTRATES CORPORATION |
发明人 |
DOURIET, DANIEL, F.;HERNANDEZ, JORGE, M.;PANICKER, M., P., RAMACHANDRA |
分类号 |
H01P1/04;H01L23/66;H05K1/02;H05K3/34 |
主分类号 |
H01P1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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