发明名称 |
SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND CAMERA-MODULE MANUFACTURING METHOD |
摘要 |
A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.
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申请公布号 |
US2008049127(A1) |
申请公布日期 |
2008.02.28 |
申请号 |
US20070843821 |
申请日期 |
2007.08.23 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
MAEDA HIROSHI;SHIMIZU SHIGEHISA;NISHIDA KAZUHIRO |
分类号 |
H01L27/14;H01L23/00;H01L23/02;H01L23/52;H01L27/148;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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