| 摘要 |
A method for controlling wafer flatness using a seasoning plate is provided to control the water flatness in an optimized sate by monitoring a wafer shape after both sides polishing process. A both sides polishing process is performed by using a both sides polishing device including an upper plate, a lower plate, and a wafer carrier. The wafer is monitored. The seasoning plate made of the ceramic material is interposed between the upper plate and the lower plate. The pressure pressing the seasoning plate, the seasoning time, and the abradant temperature are set based on the shape of the monitored wafer. The flatness of the polishing pad is regular by pressurizing the seasoning plate.
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