PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN AND NOVOLAK RESIN

摘要

Provided is a specified resin composition which can easily control the angle of the lateral sides of a pattern, as a photosensitive-heat resistant resin composition comprising a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. When the photosensitive heat-resistant resin composition is used, the difference of development between an exposed portion and an unexposed portion in forming patterns is great, and sensitivity, resolution, heat resistance and adhesive properties are very excellent. Especially, the angle of the lateral sides of patterns can be easily controlled by a composition ratio of the resins. Thus, the resin composition can be used in forming a pattern circuit on an insulating layer of an OLED.