Electrically Conductive Joining Agent and Solder Joint

摘要

This invention has an object to provide an electrically conductive joining agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn of 40% or more, thermosetting resin, an acid-anhydride-based hardening agent and an organic acid. The electrically conductive metallic powder and the organic acid are reacted during a heating process to produce an organic acid metal salt which is used as hardening accelerator. It enables thermosetting resin to cure in a short time, for example, a time equivalent to a time that is required for the general reflow process.

主权项

1. An electrically conductive joining agent containing:
electrically conductive metallic powder including Sn of 40 weight % or more; thermosetting resin; an acid-anhydride-based hardening agent; and an organic acid, wherein the electrically conductive metallic powder and the organic acid are reacted to produce an organic acid metal salt and the organic acid metal salt is used as hardening accelerator.