发明名称 COIL COMPONENT AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a coil component which achieves high attenuation characteristics, enables improvement of the mountability, and prevents defects such as warpage, and to provide a manufacturing method of the coil component.SOLUTION: A coil component 100 includes: a magnetic substrate 110; an insulation layer 120 disposed on the magnetic substrate 110 and in which coil conductors are formed; and a reinforcement layer 130 disposed on the insulation layer 120 and having a heat expansion coefficient smaller than that of the insulation layer 120. Preferably, the heat expansion coefficient of the reinforcement layer 130 is larger than a heat expansion coefficient of the magnetic substrate 110. The reinforcement layer 130 is formed by a non-magnetic material and made of a polymeric resin or a mixture of the polymeric resin and an inorganic filler.SELECTED DRAWING: Figure 1
申请公布号 JP2016139785(A) 申请公布日期 2016.08.04
申请号 JP20150229394 申请日期 2015.11.25
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK SEUNG WOOK;KIM KWANG MO;SIM WON CHUL
分类号 H01F17/04;H01F17/00;H01F27/29 主分类号 H01F17/04
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