发明名称 |
COIL COMPONENT AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a coil component which achieves high attenuation characteristics, enables improvement of the mountability, and prevents defects such as warpage, and to provide a manufacturing method of the coil component.SOLUTION: A coil component 100 includes: a magnetic substrate 110; an insulation layer 120 disposed on the magnetic substrate 110 and in which coil conductors are formed; and a reinforcement layer 130 disposed on the insulation layer 120 and having a heat expansion coefficient smaller than that of the insulation layer 120. Preferably, the heat expansion coefficient of the reinforcement layer 130 is larger than a heat expansion coefficient of the magnetic substrate 110. The reinforcement layer 130 is formed by a non-magnetic material and made of a polymeric resin or a mixture of the polymeric resin and an inorganic filler.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016139785(A) |
申请公布日期 |
2016.08.04 |
申请号 |
JP20150229394 |
申请日期 |
2015.11.25 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK SEUNG WOOK;KIM KWANG MO;SIM WON CHUL |
分类号 |
H01F17/04;H01F17/00;H01F27/29 |
主分类号 |
H01F17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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