发明名称 INSPECTION APPARATUS AND INSPECTION METHOD FOR CONNECTION CONDITION OF ELECTRICAL CONNECTION LOCATION
摘要 PROBLEM TO BE SOLVED: To detect a weak current flowing through a measurement circuit, capable of being set to detect as low as 50mV of potential difference, and detect almost all of the solder cracks in an electronic circuit. SOLUTION: The inspection apparatus for the connection conditions of an electrically connected connecting part comprises two probes, which are brought into contact with two points sandwiching the connection part and apply mechanical stress to the connection location, a means of detecting a predetermined potential difference generated between the two points by applying mechanical stress, and a means of informing the generation of the potential difference. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005207845(A) 申请公布日期 2005.08.04
申请号 JP20040013763 申请日期 2004.01.22
申请人 SOYO DENSHI KK 发明人 HIRAYAMA BUNICHI
分类号 G01R31/02;G01R15/12;G01R31/28;(IPC1-7):G01R31/02 主分类号 G01R31/02
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