发明名称 TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS
摘要 A test contact element (56,57,58) for making temporary electrical contact with a microcircuit terminal comprises at least one resilient finger (56a,56b,57a,57b) projecting from an insulating contact membrane (50) as a cantilevered beam. The finger has on a contact side thereof, a conducting contact pad for contacting the microcircuit terminal. Preferably the test contact element has a plurality of fingers, where each finger is defined at least in part by two radially oriented slots (62) in the membrane that mechanically separate each finger from every other finger of the plurality of fingers forming the test contact element. A plurality of the test contact elements can form a test contact element array (40) comprising with the test contact elements arranged in a predetermined pattern. A plurality of connection vias preferably in an interface membrane are arranged in substantially the predetermined pattern of the test contact elements, with each of said connection vias aligned with one of the test contact elements. The connection vias may have a cup shape with an open end, with the open end of the cup-shaped via contacting the aligned test contact element. The contact and interface membranes may be used as part of a test receptacle including a load board on which individual microcircuits are mounted for testing.
申请公布号 SG134271(A1) 申请公布日期 2007.08.29
申请号 SG20070003320 申请日期 2007.01.17
申请人 JEFFREY C. SHERRY 发明人 SHERRY JEFFREY C.
分类号 主分类号
代理机构 代理人
主权项
地址