| 摘要 |
A surface mount electrical component comprising a first soldering interface having a fist soldering interface total solder path length of sufficient length such that a first melted solder fillet substantially disposed along the first soldering interface total solder path length produces an first upward moment greater than a first downward moment produced by the weight of the surface mount electrical component about the first soldering interface, and a second soldering interface comprising a second soldering interface total solder path length such that a surface tension produced by a second melted solder fillet substantially disposed along the second soldering interface total solder path length produces a second upward moment greater than a second downward moment produced by the weight of the surface mount electrical component about the second soldering interface is disclosed.
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