发明名称 |
STACK-LAYERED NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME AND MEMORY CARD AND SYSTEM INCLUDING THE SAME |
摘要 |
<p>PURPOSE: A stack-layered nonvolatile memory device, a method of manufacturing the same and a memory card and a system including the same are provided to form the top parts of a common source line and/or a bit line contact plug in a lower portion than the top part of a gate structure, thereby improving device reliability by preventing defects of a contact. CONSTITUTION: A stack-layered nonvolatile memory device includes a lower memory layer, lower contact units, an upper memory layer, and upper contact units. The lower memory layer(1) includes a lower active area and a plurality of lower gate structures. The upper contact units are electrically connected to the active area. Partial top parts of the upper contact units are formed in a lower portion than the top part of the upper gate structures.</p> |
申请公布号 |
KR20090120688(A) |
申请公布日期 |
2009.11.25 |
申请号 |
KR20080046619 |
申请日期 |
2008.05.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, YOUNG CHUL;JUNG, SOON MOON;KIM, HAN SOO;KIM, JONG HYUK;PARK, JUN BEOM;SONG, MIN SUNG |
分类号 |
H01L21/8247;H01L27/115 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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