发明名称 STACK-LAYERED NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME AND MEMORY CARD AND SYSTEM INCLUDING THE SAME
摘要 <p>PURPOSE: A stack-layered nonvolatile memory device, a method of manufacturing the same and a memory card and a system including the same are provided to form the top parts of a common source line and/or a bit line contact plug in a lower portion than the top part of a gate structure, thereby improving device reliability by preventing defects of a contact. CONSTITUTION: A stack-layered nonvolatile memory device includes a lower memory layer, lower contact units, an upper memory layer, and upper contact units. The lower memory layer(1) includes a lower active area and a plurality of lower gate structures. The upper contact units are electrically connected to the active area. Partial top parts of the upper contact units are formed in a lower portion than the top part of the upper gate structures.</p>
申请公布号 KR20090120688(A) 申请公布日期 2009.11.25
申请号 KR20080046619 申请日期 2008.05.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, YOUNG CHUL;JUNG, SOON MOON;KIM, HAN SOO;KIM, JONG HYUK;PARK, JUN BEOM;SONG, MIN SUNG
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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