发明名称 |
BUCKLE FOR HEAT RADIATION FIN |
摘要 |
A buckle for a heat radiation fin. The buckle for a heat radiation fin comprises a support for buckling a chip. The support is provided with a support element for supporting the support and a fixing element for fixing a heat radiation fin. One end of the support element is connected to the support and the other end of the support element is inserted into a gap between the chip and a main board. The buckle for a heat radiation fin can solve the technical problems of assembly and disassembly inconvenience of the heat radiation fin and poor heat radiation effect caused when the heat radiation fin is bonded to the chip by using heat-conducting glue at present. |
申请公布号 |
WO2016090918(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
WO2015CN84498 |
申请日期 |
2015.07.20 |
申请人 |
ZTE CORPORATION |
发明人 |
YU, FANGXIANG;ZHANG, XIANMING;JING, HUANQIANG |
分类号 |
H01L23/40;G06F1/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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