ADHESIVE, DIE BOND MATERIAL COMPRISING ADHESIVE, CONDUCTIVE CONNECTION METHOD USING ADHESIVE, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING METHOD

摘要

The present invention pertains to an adhesive containing: (A) a curable resin composition containing one or more types selected from a silicone resin, a modified silicone resin, an epoxy resin, and a modified epoxy resin; and (B) conductive particles having an average particle diameter of 1μm or less. Therein, the (B) component content is more than 0 vol% and less than 0.1 vol% relative to the solid content of the (A) component, the total light transmittance of a cured article obtained by curing the adhesive and having a thickness of 2mm is 70% or higher, and the haze value thereof is 60% or lower. As a result, the provided adhesive achieves a cured article having high transparency, exhibiting excellent adhesive strength and workability, and having heat resistance and light resistance.